Polyimide bake infrared lamp

Sat, 20 Jun 2026 02:32:11 +0800

On the litho floor, the polyimide bake is where thermal budget turns into line-width control. A few degrees of drift shows up as sidewall skew. A hot spot shows up as particle count on the wafer. The bake step has to be repeatable, clean, and fast—every single lot. What matters under the hood We built this polyimide bake around an infrared lamp whose NIR response is matched to polyimide absorption. Energy goes where the film needs it, without cooking the substrate. That gives wafer-level temperature uniformity of ±0.1°C across the bake surface, and setpoint stability that holds through long lots. The emitter is engineered for Class 1–100 cleanroom operation, with materials and seals chosen to keep particle generation at zero. In production, that translates to fewer excursions, tighter CD distribution, and predictable yield. Why it fits the process flow Polyimide soft bake and hard bake sit right in the middle of the photoresist thermal chain. Our lamp drops into existing bake tracks as a verified, SEMI-grade equivalent. You keep the same process intent, but you get faster ramp-to-soak, lower energy draw per batch, and longer emitter life—backed by 5,000+ hours of stable output aligned with international equipment expectations. For line engineers, that means less rework, fewer maintenance windows, and bake profiles that repeat lot after lot. The practical details Retrofit is straightforward, but alignment tolerance is tight. The lamp has to be positioned to the specific hot-plate geometry to preserve uniformity. Expect a short commissioning run to lock in the bake profile and verify temperature mapping. Once it’s set, treat it as a controlled process variable. Then make thermal repeatability something you count on, not something you chase.

Bake on Modern Infrared Home Heating

Polyimide bake infrared lamp